Wire Bond 2D/3D AVI
Ball · Wire · Stitch High-speed Inspection
Super Wide 240 × 77.5mm
RHEA TECH / PRODUCTS
High-precision systems for inspection and production equipment control in semiconductor manufacturing.
Ball · Wire · Stitch High-speed Inspection
Super Wide 240 × 77.5mm
PKG Top & Bottom View PoP
SECS/GEM Interface
Material Max. 240 × 95mm
Integrated Marking Support
Green 532nm · UV 355nm · CO₂
Work Area 300 × 300mm
Auto Align · Accuracy ±10μm
Max. 1.7 sec/unit
Integrated semiconductor gas supply
and production line control

Integrated equipment for high-speed panel inspection, precision alignment, and laser repair.
Mobile · Tablet OLED Panel
Vision · Characteristics · MURA Inspection
Panel 1–15 inch
Visual Pad Type
Mobile · Tablet OLED
Auto Laser Repair
26–105 inch Monitor & TV
Panel In / Out 1,050mm
Vision · Visual · Luminance Inspection
Color Coordinate Calibration
Blade Resolution ±1μm
Film Thickness Variation ≤ ±3μm

High-speed image processing systems that improve defect detection and product quality.
Pin presence · Bend · Cut · Hole
Position error inspection ±20μm
Bare Glass Edge Inspection
Crack · Chipping · Broken
Chip Presence · Crack · Broken · Double
Detection > 50μm
We extend our control and sensing capabilities into medical devices and VR/AR applications.
Gait Training · Motion Analysis
Inertial Measurement Unit
Virtual Reality · Augmented Reality
3D Simulator · VR Game Application